Laser Processing Machine
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LC-2Q Series
CO2 laser processing machine for high-end HDI and package PCBs-
Number of panels/beams
2P/2B
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Applications
- HDI
- BGA
- CSP
- FC-BGA
- FPC
- Multilayer board for automotive, communication infrastructure and server
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Features
A high speed, high precision CO2 laser processing machine for high-end HDI and package PCBs. Precise pulse control through new galvano control technology, reduced non-operating time through a unique applications.
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Number of panels/beams
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LC-4N Series
CO2 Laser Processing Machine for New Generation Package PCBs-
Number of panels/beams
2P/4B
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Applications
- HDI
- BGA
- CSP
- FC-BGA
- FPC
- Multilayer board for automotive, communication infrastructure and server
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Features
Achieves high-precision hole position accuracy at the highest level in the world Achieved 20,000hole/sec. with high power laser head and nwe optical sysytem.
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Number of panels/beams
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LU-2L Series
UV + CO 2 Laser processing machine for multilayer board-
Number of panels/beams
2P/2B
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Applications
- HDI
- BGA
- CSP
- FC-BGA
- FPC
- Multilayer board for automotive, communication infrastructure and server
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Features
Suitable for mass production of micro hole of flexible board. Equipped beam mode switching function, flexibly processing to many kind of materials. Capable of countour processing for FPC with routing function.
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Number of panels/beams
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LU-4NF Series
UV Laser Processing Machine for New Generation Package PCBs-
Number of panels/beams
2P/4B
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Applications
- HDI
- BGA
- CSP
- FC-BGA
- FPC
- Multilayer board for automotive, communication infrastructure and server
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Features
The world’s highest level of hole position accuracy and micro hole processing. Achieved 8,000hole/sec. with high power and high ferquency laser head and high speed Galvano sysytem.
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Number of panels/beams
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LUC-2K Series
UV + CO 2 laser processing machine for multilayer board-
Number of panels/beams
1P/2B (UV and CO2)
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Applications
- HDI
- BGA
- CSP
- FC-BGA
- FPC
- Multilayer board for automotive, communication infrastructure and server
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Features
To enable Cu opening with UV laser, and resin removing with CO2 laser by one machine continuously, keep hole position accuracy very high. Suitable for build-up board.of aoutomotive, communication infrastructure, and saver
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Number of panels/beams