Suitable for mass production of micro hole of flexible board. Equipped beam mode switching function, flexibly processing to many kind of materials. Capable of countour processing for FPC with routing function.
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Panels & Beams
2P/2B
- HDI
- BGA
- CSP
- FC-BGA
- FPC
- Multilayer board for automotive, communication infrastructure and server.
- Specification
- Features
Product Type LU-2L212 Max. Drilling Area 690mm x 560mｍ
2 panelXY axis Feed Rate 50m/min Number of Beams 2 Laser Output S-TA20: 20W / C-AN25: 25W Galvano Scan Ares 50 x 50mm / 30 x 30mm CNC MARK-50L - Suitable for mass production of micro hole of flexible board. Equipped beam mode switching function, flexibly proccesing to many kind of materials. Capable of countour processing for FPC with routing function.