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Via Mechanics, Ltd.

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LU-2L Series

UV + CO 2 Laser processing machine for multilayer board

LU-2L Series

Suitable for mass production of micro hole of flexible board. Equipped beam mode switching function, flexibly processing to many kind of materials. Capable of countour processing for FPC with routing function.

  • Panels & Beams

    2P/2B

  • HDI
  • BGA
  • CSP
  • FC-BGA
  • FPC
  • Multilayer board for automotive, communication infrastructure and server.
  • Specification
  • Features
  • Product Type LU-2L212
    Max. Drilling Area 690mm x 560mm 
    2 panel
    XY axis Feed Rate 50m/min
    Number of Beams 2
    Laser Output S-TA20: 20W / C-AN25: 25W
    Galvano Scan Ares 50 x 50mm / 30 x 30mm
    CNC MARK-50L
  • Suitable for mass production of micro hole of flexible board. Equipped beam mode switching function, flexibly proccesing to many kind of materials. Capable of countour processing for FPC with routing function.
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