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Via Mechanics, Ltd.

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Product & Solution

LUC-2K Series

UV + CO 2 laser processing machine for multilayer board

LUC-2K Series

To enable Cu opening with UV laser, and resin removing with CO2 laser by one machine continuously, keep hole position accuracy very high. Suitable for build-up board.of aoutomotive, communication infrastructure, and saver.

  • Panels & Beams

    1P/2B (UV and CO2)

  • HDI
  • BGA
  • CSP
  • FC-BGA
  • FPC
  • Multilayer board for automotive, communication infrastructure and server.
  • Specification
  • Features
  • Product Type LUC-2K21 / LUC-2K24
    Max. Drilling Area LUC-2K21:760mm×560mm
    LUC-2K24:760mm×610mm
    1 panel
    XY axis Feed Rate 50m/min
    Number of Beams 2 (UV: 1 head, CO 2: 1 head)
    Laser Output UV:S-TA15 /: 15W, CO2:190W
    Galvano Scan Ares CO2: 50 x 50mm / UV: 30 x 30mm
    CNC MARK-50L
  • To enable Cu opening with UV laser, and resin removing with CO2 laser by one machine continuously, keep hole position accuracy very high. Suitable for build-up board.of aoutomotive, communication infrastructure, and saver
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