To enable Cu opening with UV laser, and resin removing with CO2 laser by one machine continuously, keep hole position accuracy very high. Suitable for build-up board.of aoutomotive, communication infrastructure, and saver.
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Panels & Beams
1P/2B (UV and CO2)
- HDI
- BGA
- CSP
- FC-BGA
- FPC
- Multilayer board for automotive, communication infrastructure and server.
- Specification
- Features
Product Type LUC-2K21 / LUC-2K24 Max. Drilling Area LUC-2K21：760mm×560mm
LUC-2K24：760mm×610mm
1 panelXY axis Feed Rate 50m/min Number of Beams 2 (UV: 1 head, CO 2: 1 head) Laser Output UV:S-TA15 /: 15W, CO2:190W Galvano Scan Ares CO2： 50 x 50mm / UV： 30 x 30mm CNC MARK-50L - To enable Cu opening with UV laser, and resin removing with CO2 laser by one machine continuously, keep hole position accuracy very high. Suitable for build-up board.of aoutomotive, communication infrastructure, and saver