Product & Solution

LU-4NP212

Semi-additive process UV laser processing machine for package substrates

LU-4NP212

Stabled top level hole position accuracy with temperature control.
Our original optical technology enables micro hole processing with high-quality.

Processing accuracy:
Achieves stable high-accuracy with temperature control (temperature controller).
Small diameter processability:
Selectable picosecond oscillator enables high-quality micro hole processing.

  • Panels & Beams

    2 panels/4 beams

  • HDI
  • BGA
  • CSP
  • FC-BGA
  • FPC
  • Multilayer board for automotive, communication infrastructure and server.
  • Specification
  • Product TypeLU-4NP212
    Max. Drilling Area510mm×515mm
    XY axis Feed Rate50m/min
    Number of Beams4 (2panels)
    Laser Outputns Laser: 39W (OP: ps laser: 21W)
    Galvano Scan Ares□30mm
    (OP : □20mm)
    CNCMARK-55L+