VIAMECH

Via Mechanics, Ltd.

MENU

Product & Solution

Laser Processing Machine

  • NEW
    LC-2Q Series

    LC-2Q Series

    CO2 laser processing machine for high-end HDI and package PCBs
    • Panels & Beams

      2P/2B

    • Applicable PCB
      • HDI
      • BGA
      • CSP
      • FC-BGA
      • FPC
      • Multilayer board for automotive, communication infrastructure and server
    • Features

      A high speed, high precision CO2 laser processing machine for high-end HDI and package PCBs. Precise pulse control through new galvano control technology, reduced non-operating time through a unique applications.

  • NEW
    LC-4N Series

    LC-4N Series

    CO2 Laser Processing Machine for New Generation Package PCBs
    • Panels & Beams

      2P/4B

    • Applicable PCB
      • HDI
      • BGA
      • CSP
      • FC-BGA
      • FPC
      • Multilayer board for automotive, communication infrastructure and server
    • Features

      Achieves high-precision hole position accuracy at the highest level in the world Achieved 20,000hole/sec. with high power laser head and nwe optical sysytem.

  • LU-2L Series

    LU-2L Series

    UV + CO 2 Laser processing machine for multilayer board
    • Panels & Beams

      2P/2B

    • Applicable PCB
      • HDI
      • BGA
      • CSP
      • FC-BGA
      • FPC
      • Multilayer board for automotive, communication infrastructure and server
    • Features

      Suitable for mass production of micro hole of flexible board. Equipped beam mode switching function, flexibly processing to many kind of materials. Capable of countour processing for FPC with routing function.

    Download
  • LU-4NF Series

    LU-4NF Series

    UV Laser Processing Machine for New Generation Package PCBs
    • Panels & Beams

      2P/4B

    • Applicable PCB
      • HDI
      • BGA
      • CSP
      • FC-BGA
      • FPC
      • Multilayer board for automotive, communication infrastructure and server
    • Features

      The world’s highest level of hole position accuracy and micro hole processing. Achieved 8,000hole/sec. with high power and high ferquency laser head and high speed Galvano sysytem.

    Download
  • LU-1N Series

    LU-1N Series

    For Various & Flexible Production
    • Panels & Beams

      1P/1B

    • Applicable PCB
      • HDI
      • BGA
      • CSP
      • FC-BGA
      • FPC
      • Multilayer board for automotive, communication infrastructure and server
    • Features

      1-panel 1-beam machine suitable for FPC. Applicable for smaller hole drilling (50um) and laser cutting. Suitable for various kinds, middle or small volume production.

    Download
  • LUC-2K Series

    LUC-2K Series

    UV + CO 2 laser processing machine for multilayer board
    • Panels & Beams

      1P/2B (UV and CO2)

    • Applicable PCB
      • HDI
      • BGA
      • CSP
      • FC-BGA
      • FPC
      • Multilayer board for automotive, communication infrastructure and server
    • Features

      To enable Cu opening with UV laser, and resin removing with CO2 laser by one machine continuously, keep hole position accuracy very high. Suitable for build-up board.of aoutomotive, communication infrastructure, and saver.

    Download
Top