Achieves high-speed, high-accuracy, high-quality stable processing with our in-house core technologies.
Supporting a wide range of applications from general-purpose build-up to semiconductor interposer.
The VIA original technology:
Modulation function controlling the pulse oscillation, highly effective in avoiding processing heat effects.
Avoiding 3 layer processing penetration and bottom damage.
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Panels & Beams
2 panels/2 beams
- HDI
- BGA
- CSP
- FC-BGA
- FPC
- Multilayer board for automotive, communication infrastructure and server.
- Specification
Model LC-2QS252 Max. Drilling Area 635mｍ x 813mm XY Positioning Speed 50m/min Number of Beams 2(2 panels) Laser Output 640W Galvano Scan Area □70mm
(OP : □30mm, □50mm)CNC MARK-55L+