UV laser processing machine that realizes micro hole processing to various materials with high-speed and high-accuracy.
High-productivity:
Selectable new high-speed trepanning system enables higher productivity.
Micro hole processing:
Selectable picosecond oscillator enables high-quality micro hole processing.
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Panels & Beams
2 panels/2 beams
- HDI
- BGA
- CSP
- FC-BGA
- FPC
- Multilayer board for automotive, communication infrastructure and server.
- Specification
Model LU-2QS252 Max. Drilling Area 635mｍ x 813mm XY Positioning Speed 50m/min Number of Beams 2(2 panels) Laser Output ns Laser: 30W (OP: 25W, 20W, 15W)
ps laser: 21 WGalvano Scan Area □30mm
(OP : □50mm)CNC MARK-55L+