LU-4NP212
Semi-additive process UV laser processing machine for package substrates
Stabled top level hole position accuracy with temperature control.
Our original optical technology enables micro hole processing with high-quality.
Processing accuracy:
Achieves stable high-accuracy with temperature control (temperature controller).
Small diameter processability:
Selectable picosecond oscillator enables high-quality micro hole processing.
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Panels & Beams
2 panels/4 beams
- HDI
- BGA
- CSP
- FC-BGA
- FPC
- Multilayer board for automotive, communication infrastructure and server.
- Specification
Product Type LU-4NP212 Max. Drilling Area 510mm×515mm XY axis Feed Rate 50m/min Number of Beams 4 (2panels) Laser Output ns Laser: 39W (OP: ps laser: 21W) Galvano Scan Ares □30mm
(OP : □20mm)CNC MARK-55L+