2 panels/2 beams

• HDI
• BGA
• CSP
• FC-BGA
• FPC
• Multilayer board for automotive, communication infrastructure and server

Achieves high-speed, high-accuracy, high-quality stable processing with our in-house core technologies.
Supporting a wide range of applications from general-purpose build-up to semiconductor interposer.

The VIA original technology:
Modulation function controlling the pulse oscillation, highly effective in avoiding processing heat effects.
Avoiding 3 layer processing penetration and bottom damage.

2 panels/2 beams

• HDI
• BGA
• CSP
• FC-BGA
• FPC
• Multilayer board for automotive, communication infrastructure and server

UV laser processing machine that realizes micro hole processing to various materials with high-speed and high-accuracy.

High-productivity:
Selectable new high-speed trepanning system enables higher productivity.
Micro hole processing:
Selectable picosecond oscillator enables high-quality micro hole processing.

2 panels/4 beams

• HDI
• BGA
• CSP
• FC-BGA
• FPC
• Multilayer board for automotive, communication infrastructure and server

Achieves high-productivity and high-accuracy processing with 2 panels/4 beams, in-house manufactured galvano and zero mechanical yawing, optimum for high volume production.

High-productivity:
Achieves high-productivity with our in-house manufactured high-speed galvano.
Processing accuracy:
Achieves high-precision with positioning
compensation technology by using glass master.

2 panels/4 beams

• HDI
• BGA
• CSP
• FC-BGA
• FPC
• Multilayer board for automotive, communication infrastructure and server

Stabled top level hole position accuracy with temperature control.
Our original optical technology enables micro hole processing with high-quality.

Processing accuracy:
Achieves stable high-accuracy with temperature control (temperature controller).
Small diameter processability:
Selectable picosecond oscillator enables high-quality micro hole processing.

1 panel/2 beams　　　　　　　　　(UV: 1 beam,CO2: 1 beam)

• HDI
• BGA
• CSP
• FC-BGA
• FPC
• Multilayer board for automotive, communication infrastructure and server

Extremely high hole position accuracy based on inner layer by performing a series of Cu opening with UV laser, and resin removing with CO2 laser. Optimum for high-quality, high-accuracy to process multilayer board for automotive, communication infrastructure and server that emphasizes reliability.