High-speed panel transfer system further refined. User-friendly operation with multi-language operation panel, operation control software, trouble-shooting function.
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Imaging
Contact Exposure
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L/S
50 /50 um
- PC/Motherboard
- HDI
- BGA
- CSP
- FC-BGA
- Package
- Specifications
Imaging Size 250×330～535×635mm Panel Thickness 0.05～3.2mm Light source Short-arc Lamp
5.0kW