VIAMECH

Via Mechanics, Ltd.

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Exposure Machine

  • DE-8WH

    DE-8WH

    For FOWLP and FOPLP, specialized for high precision package. (2.1D, 2.5D)
    • Imaging

      Direct Exposure

    • L/S

      2/2μm um

    • Applicable PCB
      • PC/Motherboard
      • HDI
      • BGA
      • CSP
      • FC-BGA
      • Package
    • Features

      The newest machine for FOWLP and FOPLP processing, specialized for high precision package processing. Features the highest level of resolution and superposition precision in the industry. (2/2 μm Overlay +/-1 μm) A single unit is capable of processing for 620x600mm panels and φ300mm wafers.(Will be released on July, 2017)

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  • DE-UH Series

    DE-UH Series

    The world's highest level resolution and productivity
    • Imaging

      Direct Exposure

    • L/S

      8 /8 um

    • Applicable PCB
      • PC/Motherboard
      • HDI
      • BGA
      • CSP
      • FC-BGA
      • Package
    • Features

      The direct exposure machine in the spotlight leading the next generation of circuit formation

  • DE-ES Series

    DE-ES Series

    High-resolution and High-productivity for HDI
    • Imaging

      Direct Exposure

    • L/S

      15 /15 um

    • Applicable PCB
      • PC/Motherboard
      • HDI
      • BGA
      • CSP
      • FC-BGA
      • Package
    • Features

      Fine Exposure and productivity with further improvement of high-speed data processing and scanning range of 535 mm width panel at single scan as standard specification.

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  • EV2400E

    EV2400E

    High-productivity, Operability & Cleanliness
    • Imaging

      Contact Exposure

    • L/S

      50 /50 um

    • Applicable PCB
      • PC/Motherboard
      • HDI
      • BGA
      • CSP
      • FC-BGA
      • Package
    • Features

      High-speed panel transfer system further refined. User-friendly operation with multi-language operation panel, operation control software, trouble-shooting function.

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  • EV7100E

    EV7100E

    The Best-Seller, Reliability, High-Speed & Precision
    • Imaging

      Contact Exposure

    • L/S

      75 /75 um

    • Applicable PCB
      • PC/Motherboard
      • HDI
      • BGA
      • CSP
      • FC-BGA
      • Package
    • Features

      HIgh-tact time (the best level in the industry) as ever and applicable for larger size panel imaging with improvement of the transfer system. Mechanical cramp adopted to warp or high tack panel in solder resit process.

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