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Via Mechanics, Ltd.

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EV7100E

The Best-Seller, Reliability, High-Speed & Precision

EV7100E

HIgh-tact time (the best level in the industry) as ever and applicable for larger size panel imaging with improvement of the transfer system. Mechanical cramp adopted to warp or high tack panel in solder resit process.

  • Imaging

    Contact Exposure

  • L/S

    75 /75 um

  • PC/Motherboard
  • HDI
  • BGA
  • CSP
  • FC-BGA
  • Package
  • Specifications
  • Imaging Size 300×300
    (Transmitted illumination: 300x535mm、 Thin plate: 330×635mm)
    Panel Thickness 0.1~3.2mm
    (~2.4mm, Mechanical Cramp)
    Light Source [CL] Short-arc Lamp 5.0kW
    [LR] Metal halide Lamp 12.0kW
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