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Via Mechanics, Ltd.

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DE-8WH

For FOWLP and FOPLP, specialized for high precision package. (2.1D, 2.5D)

DE-8WH

The newest machine for FOWLP and FOPLP processing, specialized for high precision package processing. Features the highest level of resolution and superposition precision in the industry. (2/2 μm Overlay +/-1 μm) A single unit is capable of processing for 620x600mm panels and φ300mm wafers.(Will be released on July, 2017)

  • Imaging

    Direct Exposure

  • L/S

    2/2μm um

  • PC/Motherboard
  • HDI
  • BGA
  • CSP
  • FC-BGA
  • Package
  • Specifications
  • Features
  • Imaging size 620x600mm
    Panel Thickness 0.1~2.0mm
    Light Source Laser-diode 405nm
  • The newest machine for FOWLP and FOPLP processing, specialized for high precision package processing. Features the highest level of resolution and superposition precision in the industry. (2/2 μm Overlay +/-1 μm) A single unit is capable of processing for 620x600mm panels and φ300mm wafers.
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