The newest machine for FOWLP and FOPLP processing, specialized for high precision package processing. Features the highest level of resolution and superposition precision in the industry. （2/2 μm Overlay +/-1 μm） A single unit is capable of processing for 620x600mm panels and φ300mm wafers.（Will be released on July, 2017)
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Imaging
Direct Exposure
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L/S
2/2μm um
- PC/Motherboard
- HDI
- BGA
- CSP
- FC-BGA
- Package
- Specifications
- Features
Imaging size 620x600mm Panel Thickness 0.1～2.0mm Light Source Laser-diode 405nm - The newest machine for FOWLP and FOPLP processing, specialized for high precision package processing. Features the highest level of resolution and superposition precision in the industry. （2/2 μm Overlay +/-1 μm） A single unit is capable of processing for 620x600mm panels and φ300mm wafers.