Exposure Machine
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DE-8WH
For FOWLP and FOPLP, specialized for high precision package. （2.1D, 2.5D）-
Imaging
Direct Exposure
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L/S
2/2μm um
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Applicable PCB
- PC/Motherboard
- HDI
- BGA
- CSP
- FC-BGA
- Package
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Features
The newest machine for FOWLP and FOPLP processing, specialized for high precision package processing. Features the highest level of resolution and superposition precision in the industry. （2/2 μm Overlay +/-1 μm） A single unit is capable of processing for 620x600mm panels and φ300mm wafers.（Will be released on July, 2017)
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Imaging
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DE-UH Series
The world's highest level resolution and productivity-
Imaging
Direct Exposure
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L/S
8 /8 um
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Applicable PCB
- PC/Motherboard
- HDI
- BGA
- CSP
- FC-BGA
- Package
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Features
The direct exposure machine in the spotlight leading the next generation of circuit formation
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Imaging
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DE-ES Series
High-resolution and High-productivity for HDI-
Imaging
Direct Exposure
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L/S
15 /15 um
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Applicable PCB
- PC/Motherboard
- HDI
- BGA
- CSP
- FC-BGA
- Package
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Features
Fine Exposure and productivity with further improvement of high-speed data processing and scanning range of 535 mm width panel at single scan as standard specification.
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Imaging
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EV2400E
High-productivity, Operability & Cleanliness-
Imaging
Contact Exposure
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L/S
50 /50 um
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Applicable PCB
- PC/Motherboard
- HDI
- BGA
- CSP
- FC-BGA
- Package
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Features
High-speed panel transfer system further refined. User-friendly operation with multi-language operation panel, operation control software, trouble-shooting function.
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Imaging
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EV7100E
The Best-Seller, Reliability, High-Speed & Precision-
Imaging
Contact Exposure
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L/S
75 /75 um
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Applicable PCB
- PC/Motherboard
- HDI
- BGA
- CSP
- FC-BGA
- Package
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Features
HIｇｈ-tact time (the best level in the industry) as ever and applicable for larger size panel imaging with improvement of the transfer system. Mechanical cramp adopted to warp or high tack panel in solder resit process.
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Imaging