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Via Mechanics, Ltd.

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LC-2Q Series

CO2 laser processing machine for high-end HDI and package PCBs

LC-2Q Series

A high speed, high precision CO2 laser processing machine for high-end HDI and package PCBs. Precise pulse control through new galvano control technology, reduced non-operating time through a unique applications.

  • Panels & Beams

    2P/2B

  • HDI
  • BGA
  • CSP
  • FC-BGA
  • FPC
  • Multilayer board for automotive, communication infrastructure and server.
  • Specification
  • Features
  • Product Type LC-2Q252
    Max. Drilling Area 813mm x 635mm 
    2 panel
    X, Y axis Feed Rate 50m/min
    Number of Beams 2
    Laser Output H3050 / 500W
    Galvano Scan Area 70 x 70mm
    (OP 50 x 50/30 x 30mm)
    CNC MARK-55L
  • A high speed, high precision CO2 laser drilling machine for high-end HDI and package PCBs. Precise pulse control through newly developed galvano control technology, greatly reduces non-operating time through a diverse selection of applications.
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