A high speed, high precision CO2 laser processing machine for high-end HDI and package PCBs. Precise pulse control through new galvano control technology, reduced non-operating time through a unique applications.
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Panels & Beams
2P/2B
- HDI
- BGA
- CSP
- FC-BGA
- FPC
- Multilayer board for automotive, communication infrastructure and server.
- Specification
- Features
Product Type LC-2Q252 Max. Drilling Area 813mm x 635mｍ
2 panelX, Y axis Feed Rate 50m/min Number of Beams 2 Laser Output H3050 / 500W Galvano Scan Area 70 x 70mm
（OP 50 x 50/30 x 30mm)CNC MARK-55L - A high speed, high precision CO2 laser drilling machine for high-end HDI and package PCBs. Precise pulse control through newly developed galvano control technology, greatly reduces non-operating time through a diverse selection of applications.